Granite Precision Components In The Semiconductor industry

The application of granite precision components in the semiconductor industry primarily benefits from their unique physical and chemical properties, including high rigiditylow thermal expansion coefficientexceptional vibration damping performancechemical stability, and wear resistance. These characteristics make granite an ideal material for critical components in semiconductor manufacturing equipment.

1. Precision Equipment Base Support Structures

Applications: Lithography machines, wafer inspection equipment, CMP (Chemical Mechanical Polishing) equipment, etc.
Functions:

  • Vibration Damping Stability: Granite’s high damping properties absorb external vibrations and internal mechanical oscillations, ensuring stable operation at nanoscale precision.
  • Thermal Stability: Its low thermal expansion coefficient (approximately 1/3 that of steel) maintains geometric stability under temperature fluctuations, preventing calibration failure due to thermal deformation.
  • High Rigidity: Resists bending when supporting heavy components, ensuring long-term accuracy.

2. Lithography Machine Critical Components

Applications: Baseplates, guide rails, stages, and other components in EUV (Extreme Ultraviolet) lithography systems.
Functions:

  • Ultra-Precise Positioning: Granite’s stability minimizes micro-motion errors, meeting the nanoscale positioning requirements of lithography machines (e.g., ASML systems).
  • Environmental Resistance: Insensitivity to humidity and temperature variations makes it ideal for cleanroom environments.
  • Hybrid Structures: Often combined with ceramics or composites to balance stiffness and lightweight demands.

3. Wafer Processing and Inspection Platforms

Applications: Worktables for wafer dicing, etching, thin-film deposition, and defect inspection equipment.
Functions:

  • Flatness Retention: Granite’s naturally high flatness (achieving sub-micron levels through grinding) ensures uniform wafer support.
  • Chemical Resistance: Withstands corrosive chemicals (acids, alkalis) used in processes, extending equipment lifespan.
  • Anti-Static Treatment: Surface coatings prevent electrostatic adsorption of particles, avoiding wafer contamination.

4. High-Precision Measurement and Alignment Systems

Applications: Wafer alignment tools, reticle calibration devices, laser interferometer bases.
Functions:

  • Long-Term Dimensional Stability: Minimal creep over time reduces recalibration frequency.
  • Low Thermal Hysteresis: Rapid recovery after temperature changes ensures measurement repeatability.

5. Robotic Arms and Transfer Systems

Applications: Wafer-handling robots, automated transfer guide rails.
Functions:

  • Wear Resistance: Maintains surface smoothness under prolonged high-frequency sliding friction.
  • Lightweight Design: Uses porous granite or composite structures to reduce weight while preserving rigidity.

Advantages Summary

PropertyValue in Semiconductor Industry
High Rigidity & DampingSuppresses vibrations, ensures nanoscale machining accuracy
Low Thermal Expansion (≈3×10⁻⁶/°C)Stable dimensions under temperature fluctuations, minimizes thermal errors
Chemical InertnessResists corrosive process environments (e.g., etching, cleaning)
High Hardness (Mohs 6-7)Wear-resistant, extends equipment lifespan
Insulation & Anti-StaticPrevents electrostatic damage to sensitive components

Sincerely looking forward to cooperating!